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首页> 外文期刊>Japanese journal of applied physics >Evaluation of Interface Property and DC Characteristics Enhancement in Nanoscale n-Channel Metal-Oxide-Semiconductor Field-Effect Transistor Using Stress Memorization Technique
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Evaluation of Interface Property and DC Characteristics Enhancement in Nanoscale n-Channel Metal-Oxide-Semiconductor Field-Effect Transistor Using Stress Memorization Technique

机译:使用应力记忆技术评估纳米级n沟道金属氧化物半导体场效应晶体管的界面特性和DC特性增强

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摘要

In this letter, the advanced 40 nm technology n-channel metal-oxide-semiconductor field-effect transistor devices using the stress memorization technique (SMT) are presented. We demonstrate that SMT process would not affect the electrical characteristics of devices and can introduce higher tensile stress on channels, which enhances drive current. Through charge pumping measurement, it can be verified that SMT does not affect Si/SiO_2 interface quality. Moreover, SMT-induced higher tensile stress decreases not only scattering coefficient but also tunneling attenuation length, resulting in smaller input-referred noise, which represents an intrinsic advantage of low-frequency noise performance.
机译:在这封信中,介绍了使用应力记忆技术(SMT)的先进的40 nm技术n沟道金属氧化物半导体场效应晶体管器件。我们证明SMT工艺不会影响器件的电气特性,并且会在通道上引入更高的拉应力,从而提高驱动电流。通过电荷泵浦测量,可以证明SMT不会影响Si / SiO_2界面质量。此外,SMT引起的较高的拉应力不仅减小了散射系数,而且减小了隧道衰减长度,从而导致较小的输入参考噪声,这代表了低频噪声性能的固有优势。

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  • 来源
    《Japanese journal of applied physics 》 |2010年第9issue1期| p.090207.1-090207.3| 共3页
  • 作者单位

    Institute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center,Center for Micro/Nano Science and Technology, National Cheng Kung University, No. 1 Ta Hseuh Road, Tainan 701, Taiwan, R.O.C.;

    rnDepartment of Electronic Engineering, Cheng Shiu University, No. 840, Chengching Rd., Niaosong Township, Kaohsiung County 833, Taiwan, R.O.C.;

    rnInstitute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center,Center for Micro/Nano Science and Technology, National Cheng Kung University, No. 1 Ta Hseuh Road, Tainan 701, Taiwan, R.O.C.;

    rnInstitute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center,Center for Micro/Nano Science and Technology, National Cheng Kung University, No. 1 Ta Hseuh Road, Tainan 701, Taiwan, R.O.C.;

    rnInstitute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center,Center for Micro/Nano Science and Technology, National Cheng Kung University, No. 1 Ta Hseuh Road, Tainan 701, Taiwan, R.O.C.;

    rnInstitute of Microelectronics and Department of Electrical Engineering, Advanced Optoelectronic Technology Center,Center for Micro/Nano Science and Technology, National Cheng Kung University, No. 1 Ta Hseuh Road, Tainan 701, Taiwan, R.O.C.;

    rnCentral R&D Division, United Microelectronics Corporation, Tainan 741, Taiwan, R.O.C.;

    rnCentral R&D Division, United Microelectronics Corporation, Tainan 741, Taiwan, R.O.C.;

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