首页> 外文期刊>Japanese journal of applied physics >150 A SiC V-groove trench gate MOSFET with 6 x 6 mm(2) chip size on a 150 mm C-face in-house epitaxial wafer
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150 A SiC V-groove trench gate MOSFET with 6 x 6 mm(2) chip size on a 150 mm C-face in-house epitaxial wafer

机译:在150毫米C面内部外延晶片上具有6 x 6毫米(2)芯片尺寸的150 A SiC V槽沟槽栅极MOSFET

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We report the successful demonstration of large current and high-speed switching properties of SiC V-groove trench gate MOSFETs (VMOSFETs). A drain current of 150 A (at V-DS = 2 V and V-GS = 18 V) and breakdown voltage of 960 V were achieved from a packaged 6 x 6 mm(2) single chip. Moreover, short switching times of t(r) = 81 ns and t(f) = 32 ns were also obtained. To fabricate such VMOSFETs with high yield, highly uniform in-house epitaxial growth technology on a 150-mm-diameter wafer is also one of the keys, owing to its characteristic dependence on drift layer carrier concentration. (C) 2016 The Japan Society of Applied Physics
机译:我们报告了SiC V槽沟槽栅MOSFET(VMOSFET)的大电流和高速开关特性的成功演示。从封装的6 x 6 mm(2)单芯片获得150 A的漏极电流(在V-DS = 2 V和V-GS = 18 V时)和960 V的击穿电压。此外,还获得了短的开关时间t(r)= 81 ns和t(f)= 32 ns。为了高产量地制造这种VMOSFET,由于其对漂移层载流子浓度的特性依赖性,在150毫米直径的晶片上高度均匀的内部外延生长技术也是关键之一。 (C)2016年日本应用物理学会

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