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首页> 外文期刊>International Journal of Microwave and Wireless Technologies >Optimization of InP DHBT stacked-transistors for millimeter-wave power amplifiers
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Optimization of InP DHBT stacked-transistors for millimeter-wave power amplifiers

机译:用于毫米波功率放大器的InP DHBT叠层晶体管的优化

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In this paper, we report the analysis, design, and implementation of stacked transistors for power amplifiers realized on InP Double Heterojunction Bipolar Transistors (DHBTs) technology. A theoretical analysis based on the interstage matching between all the single transistors has been developed starting from the small-signal equivalent circuit. The analysis has been extended by including large-signal effects and layout-related limitations. An evaluation of the maximum number of transistors for positive incremental power and gain is also carried out. To validate the analysis, E-band three- and four-stacked InP DHBT matched power cells have been realized for the first time as monolithic microwave integrated circuits (MMICs). For the three-stacked transistor, a small-signal gain of 8.3 dB, a saturated output power of 15 dBm, and a peak power added efficiency (PAE) of 5.2% have been obtained at 81 GHz. At the same frequency, the four-stacked transistor achieves a small-signal gain of 11.5 dB, a saturated output power of 14.9 dBm and a peak PAE of 3.8%. A four-way combined three-stacked MMIC power amplifier has been implemented as well. It exhibits a linear gain of 8.1 dB, a saturated output power higher than 18 dBm, and a PAE higher than 3% at 84 GHz.
机译:在本文中,我们报告了基于InP双异质结双极晶体管(DHBT)技术实现的功率放大器堆叠晶体管的分析,设计和实现。从小信号等效电路开始,已经进行了基于所有单个晶体管之间的级间匹配的理论分析。通过包括大信号效应和与布局相关的限制,扩展了分析。还对正增量功率和增益的晶体管的最大数量进行了评估。为了验证分析结果,首次实现了E波段三层和四层InP DHBT匹配功率单元作为单片微波集成电路(MMIC)。对于三叠层晶体管,在81 GHz时已获得8.3 dB的小信号增益,15 dBm的饱和输出功率和5.2%的峰值功率附加效率(PAE)。在相同的频率下,四叠层晶体管实现了11.5 dB的小信号增益,14.9 dBm的饱和输出功率和3.8%的峰值PAE。还实现了四路组合三叠式MMIC功率放大器。在84 GHz频率下,它的线性增益为8.1 dB,饱和输出功率高于18 dBm,PAE高于3%。

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