A Modular, Chip Scale, Direct Chip Attach MEMS Package; Architecture and Processing

摘要

This paper describes the development of a chip scale microelectromechanical system (MEMS) carrier compatible with modern surface mount assembly. Such a package could facilitate the commercial implementation of many MEMS devices currently feasible only as prototypes. In order to achieve the project goals, work focused on the reduction of MEMS package volume and on the incorporation of solder interconnect technology. The design integrated advances in the fields of MEMS fabrication and microelec- tronics packaging.