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Explanation for the AC–DC Voltage Transfer Differences in Thin-Film Multijunction Thermal Converters on Silicon Chips at High Frequencies

机译:高频硅芯片上薄膜多结热转换器中AC-DC电压传输差异的解释

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摘要

In this paper, an explanation for the ac–dc voltage transfer differences at frequencies greater than 100 kHz of the standard thin-film or planar multijunction thermal converter (PMJTC) developed at the Physikalisch-Technische Bundesanstalt and fabricated on a silicon chip has been found. The simulation indicates that the capacitance of the bond pads of the heater is the reason for an increase of the ac–dc voltage transfer difference of PMJTCs with higher heater resistance to negative values. Bond pads of smaller size and larger distance are shown to improve the frequency response.
机译:在本文中,已经找到了解释说明了在Physikalisch-Technische Bundesanstalt开发并制造在硅芯片上的标准薄膜或平面多结热转换器(PMJTC)在大于100 kHz的频率下的ac-dc电压传递差异的解释。 。仿真表明,加热器的焊盘的电容是导致PMJTC的AC-DC电压传递差增大的原因,而加热器的负电阻值更高。示出了较小尺寸和较大距离的焊盘,以改善频率响应。

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