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Low-Capacitance and Fast Turn-on SCR for RF ESD Protection

机译:低电容和快速开启SCR,用于RF ESD保护

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摘要

With the smaller layout area and parasitic capacitance under the same electrostatic discharge (ESD) robustness, silicon-controlled rectifier (SCR) has been used as an effective on-chip ESD protection device in radio-frequency (RF) IC. In this paper, SCR's with the waffle layout structures are studied to minimize the parasitic capacitance and the variation of the parasitic capacitance within ultra-wide band (UWB) frequencies. With the reduced parasitic capacitance and capacitance variation, the degradation on UWB RF circuit performance can be minimized. Besides, the fast turn-on design on the low-capacitance SCR without increasing the I/O loading capacitance is investigated and applied to an UWB RF power amplifier (PA). The PA co-designed with SCR in the waffle layout structure has been fabricated. Before ESD stress, the RF performances of the ESD-protected PA are as well as that of the unprotected PA. After ESD stress, the unprotected PA is seriously degraded, whereas the ESD-protected PA still keeps the performances well.
机译:由于在相同的静电放电(ESD)鲁棒性下具有较小的布局面积和寄生电容,可控硅(SCR)已被用作射频(RF)IC中的有效片上ESD保护器件。在本文中,研究了具有华夫布局结构的SCR,以最大程度地减小超宽带(UWB)频率内的寄生电容和寄生电容的变化。利用减小的寄生电容和电容变化,可以最大程度地减少UWB RF电路性能的下降。此外,还研究了在不增加I / O负载电容的情况下在低电容SCR上进行快速接通的设计,并将其应用于UWB RF功率放大器(PA)。制作了与华夫饼布局结构中与SCR共同设计的功率放大器。在受到ESD压力之前,受ESD保护的PA的射频性能与未受保护的PA的射频性能相同。经过ESD应力后,未受保护的PA严重退化,而受ESD保护的PA仍保持良好的性能。

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