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Maximization of Good Chips Per Wafer by Optimization of Memory Redundancy

机译:通过优化存储器冗余来最大化每个晶圆的良芯片

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摘要

In the optimization of the number of good chips per wafer, yield is obviously one key factor. It plays the major role in the manufacturing phase, as at this time circuit design and chip area cannot be modified. In the design phase, however, chip area as the second factor defining good chips per wafer can still be influenced. If there are no strong relationships between yield and chip area, both can be optimized independently. In some cases, however, there are such strong relationships, and an optimum of yield gain versus area growth has to be found. Maybe the most important example where strong relationships between area and yield have to be considered is the estimation of optimum memory redundancy. In this paper, we will review and discuss relationships between yield and area and present methods for optimization of good chips per wafer, with special focus on the optimization of memory redundancy
机译:在优化每个晶片的良芯片数量时,良率显然是关键因素。它在制造阶段起着重要作用,因为此时电路设计和芯片面积无法修改。然而,在设计阶段,仍然会影响芯片面积,它是定义每个晶片好的芯片的第二个因素。如果成品率和芯片面积之间没有紧密的关系,则可以分别进行优化。但是,在某些情况下,这种关系非常紧密,必须找到产量与面积增长之间的最佳关系。也许必须要考虑面积和成品率之间的紧密关系的最重要的例子是最佳存储冗余的估计。在本文中,我们将回顾和讨论成品率与面积之间的关系,以及目前用于优化每个晶圆上好的芯片的方法,特别关注存储器冗余的优化。

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