探索晶圆级芯片贴装薄膜和芯片制备集成工艺的新挑战

摘要

分析了在多芯片叠装封装产品中采用品圆级芯片贴装薄膜对传统芯片制备以及后续封装工艺所产生的巨大影响.阐述了在晶圆级芯片贴装薄膜贴覆工艺,芯片制备以及后序工艺中所遇到的巨大挑战.%This paper analyzes the large effect on wafer preparation and down stream assembly processesby application of Wafer Level Die Attach Film (WLDAF) in multi-die stack electronic packages. It willexplore new challenges associated with WLDAF lamination, wafer preparation and down stream processes.