机译:通孔-中间工艺中TSV和触点的残余应力和弹出模拟
State Key Laboratory of Tribology, Tsinghua University, Beijing, China;
State Key Laboratory of Tribology, Tsinghua University, Beijing, China;
Department of Computer Science and Computer Engineering, University of Arkansas, Fayetteville, AR, USA;
State Key Laboratory of Tribology, Tsinghua University, Beijing, China;
State Key Laboratory of Tribology, Tsinghua University, Beijing, China;
School of ECE, Georgia Institute of Technology, Atlanta, GA, USA;
State Key Laboratory of Tribology, Tsinghua University, Beijing, China;
Through-silicon vias; Stress; Annealing; Integrated circuit modeling; Silicon; Heating systems;
机译:非骨水泥型髋关节假体插入过程的数值模拟,以评估残余应力和接触分布对骨干初始稳定性的影响
机译:基于裂纹表面局部弹性接触的模拟预测残余应力场中半椭圆形倾斜表面裂纹的扩展行为
机译:激光光斑尺寸对激光冲击处理纯铝残余应力场的影响:模拟
机译:加工残余应力对硬质加工部件滚动接触应力的影响
机译:圆角焊缝的有限元模拟:焊接接触角的影响和冶金相变对残余应力的影响
机译:将剩余联系信息包括在副本 - 交换MD模拟中显着丰富了网上的构象
机译:不同工艺参数拉丝过程中残余应力的数值模拟
机译:残余应力和孔质量对飞机结构节点疲劳性能的评估。第3卷:铆接过程和疲劳寿命的有限元模拟