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首页> 外文期刊>IEEE Transactions on Semiconductor Manufacturing >Which Spare Parts Service Measure to Choose for a Front-End Wafer Fab?
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Which Spare Parts Service Measure to Choose for a Front-End Wafer Fab?

机译:哪种备件服务措施选择前端晶片Fab?

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We are interested in the influence of spare part service measures on the performance of the front-end wafer fabrication process. This process is characterized by re-entrant flows due to the multiple layers present on chips. This exacerbates the effects of flow variability. We focus on the bottleneck resource. We consider three different service measures. The traditional aggregate fill rate and downtime waiting for parts do not take into account the number of outliers in the case of stock out. The third service measure is the number of extreme long downs, specifically designed at limiting outliers. We develop an improved method, combining optimization and simulation, to compare the performance of a front-end wafer fabrication process under these three service measures. In the studied case, the extreme long down service measure delivers superior performance and transparency. Our approach can help practitioners to choose the appropriate spare parts service measure, increasing fab performance.
机译:我们对备件服务措施对前端晶片制造过程的性能的影响感兴趣。该过程的特征在于由于芯片上存在的多层而重新参加者流动。这加剧了流动变异性的影响。我们专注于瓶颈资源。我们考虑三种不同的服务措施。传统的总填充率和停机时间等待零件没有考虑到库存的异常值的数量。第三个服务措施是极端长的下降次数,专门用于限制异常值。我们开发了一种改进的方法,结合优化和仿真,比较这三种服务措施下前端晶片制造过程的性能。在研究的情况下,极端的长期服务措施提供卓越的性能和透明度。我们的方法可以帮助从业者选择适当的备件服务措施,增加Fab性能。

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