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Simulated SEU hardened scaled CMOS SRAM cell design using gated resistors

机译:使用门控电阻器的模拟SEU硬化缩放CMOS SRAM单元设计

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摘要

The use of gated resistors as an innovative technique for hardening scaled static RAM (SRAM) designs is examined. Gated resistors are actively clocked polysilicon resistors that are used to provide single-event upset (SEU) hardness. they are placed in the cross-coupled segments of SRAM cells, similar to designs using passive polysilicon resistors. The high-resistance OFF-state of the gated resistors protects the stored cell data from SEUs. However, during write-cell cycles, the gated resistors are clocked into a low-resistance ON-state by a wordline clock signal. The resultant low-resistance current paths reduce the charging time constants of the internal cell nodes, thus preserving the fast write response to the cell. Experimental investigations of gated resistor technology demonstrated the processing capability and device feasibility. The gated resistor process was found to be easy to integrate into a radiation-hardened half-micrometer CMOS process without introducing any process complexities and without negatively affecting functional yield or degrading total dose hardness.
机译:研究了使用门控电阻器作为一种创新技术来强化缩放的静态RAM(SRAM)设计。门控电阻器是主动计时的多晶硅电阻器,可用于提供单事件击穿(SEU)硬度。它们被放置在SRAM单元的交叉耦合段中,类似于使用无源多晶硅电阻器的设计。选通电阻的高电阻OFF状态可保护存储的单元数据免受SEU的影响。然而,在写单元周期期间,通过字线时钟信号将门控电阻器时钟控制为低电阻导通状态。所得的低电阻电流路径减小了内部单元节点的充电时间常数,从而保留了对单元的快速写入响应。门控电阻器技术的实验研究证明了其处理能力和设备可行性。发现门控电阻器工艺易于集成到经过辐射硬化的半微米CMOS工艺中,而不会引起任何工艺复杂性,并且不会对功能产量或总剂量硬度产生负面影响。

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