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Full-Wave Simulation of Electromagnetic Coupling Effects in RF and Mixed-Signal ICs Using a Time-Domain Finite-Element Method

机译:使用时域有限元方法的RF和混合信号IC中电磁耦合效应的全波仿真

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This paper describes the computer simulation and modeling of distributed electromagnetic coupling effects in analog and mixed-signal integrated circuits. Distributed electromagnetic coupling effects include magnetic coupling of adjacent interconnects and/or planar spiral inductors, substrate coupling due to stray electric currents in a conductive substrate, and full-wave electromagnetic radiation. These coupling mechanisms are inclusively simulated by solving the full-wave Maxwell's equations using a three-dimensional (3-D) time-domain finite-element method. This simulation approach is quite general and can be used for circuit layouts that include isolation wells, guard rings, and 3-D metallic structures. A state-variable behavioral modeling procedure is used to construct simple linear models that mimic the distributed electromagnetic effects. These state-variable models can easily be incorporated into a VHDL-AMS simulation providing a means to include distributed electromagnetic effects into a circuit simulation.
机译:本文描述了模拟和混合信号集成电路中分布式电磁耦合效应的计算机仿真和建模。分布的电磁耦合效应包括相邻互连和/或平面螺旋电感器的磁耦合,由于导电基板中杂散电流引起的基板耦合以及全波电磁辐射。通过使用三维(3-D)时域有限元方法求解全波Maxwell方程,可以全面模拟这些耦合机制。这种仿真方法非常通用,可用于包括隔离阱,保护环和3-D金属结构的电路布局。使用状态变量行为建模过程来构建简单的线性模型,以模拟分布式电磁效应。这些状态变量模型可以轻松地合并到VHDL-AMS仿真中,从而提供一种将分布式电磁效应纳入电路仿真的方法。

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