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Long-Term Effects of Relative Humidity on the Performance of ZnO-Based MEMS Acoustic Sensors

机译:相对湿度对基于ZnO的MEMS声传感器性能的长期影响

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This paper investigates the long-term repercussions of relative humidity on capacitance and dissipation factor $tandelta$ of ZnO-based MEMS acoustic sensors. During the fabrication process, a ZnO layer covered with a 0.3- $muhbox{m}$-thick PECVD layer was sandwiched between two aluminum (Al) electrodes on a 25- $muhbox{m}$-thick silicon diaphragm made by a bulk micromachining technique. The fabrication of an acoustic sensor chip was then completed by etching a ZnO layer in the presence of strong acid (HCl) and weak acid ( $hbox{NH}_{4}hbox{Cl}$ with electrolytically added Cu ions), separately. Post fabrication, under the humid environment conditions prevailing over a long period of time, viz., 150 days, with relative humidity between 60% and 80%, the capacitance values were found to be 1.5 times higher than the original values in the case of strong acid. The corresponding losses $tandelta$ increased from 0.03 to 0.06. However, under the same conditions, the capacitance values did not change for the acoustic chips fabricated using weak acid. The deterioration in frequency and sensitivity responses of the packaged device has been also observed in the case of etching using strong acid. The investigations showed that a 0.3- $muhbox{m}$-thick PECVD silicon dioxide as a passivating layer could protect the sensors from ambient humidity over a long period of time, because of a positive slope of a ZnO edge. However, the response of the devices for a negative slope of a ZnO edge was affected due to nonuniform step coverage of a ZnO layer.
机译:本文研究了相对湿度对基于ZnO的MEMS声传感器的电容和损耗因子tandelta $的长期影响。在制造过程中,将一块厚度为0.3-muhbox {m} $的PECVD层覆盖的ZnO层夹在一块25-muhbox {m} $厚的硅膜上的两个铝(Al)电极之间。微加工技术。然后通过分别在强酸(HCl)和弱酸($ hbox {NH} _ {4} hbox {Cl} $带有电解添加的Cu离子)的存在下蚀刻ZnO层来完成声学传感器芯片的制造。 。后期制造,在潮湿的环境条件下,长时间(即150天)内普遍存在,相对湿度在60%和80%之间,发现电容值是原始值的1.5倍。强酸。相应的损失tandelta $从0.03增加到0.06。然而,在相同条件下,使用弱酸制造的声学芯片的电容值不会改变。在使用强酸蚀刻的情况下,还观察到封装器件的频率和灵敏度响应变差。研究表明,由于ZnO边缘呈正斜率,厚度为0.3-muhbox {m} $的PECVD二氧化硅作为钝化层可以长时间保护传感器免受环境湿度的影响。然而,由于ZnO层的台阶覆盖不均匀,影响了器件对于ZnO边缘的负斜率的响应。

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