The intertool profile interchange format: an object-oriented approach (semiconductor technology CAD/CAM)

摘要

A formal object-oriented approach to the data structuring and data management of semiconductor wafer structure and device information is presented. The profile interchange format (PIF) is extended beyond a file format 'intersite' version in order to enhance the storage and access of profile information, the communication of profile information between cooperating tools, and the integration and portability of technology CAD (computer-aided design) tools. An intertool PIF toolkit is a programmatic interface to profile information, consisting of a library of objects for the storage and manipulation of data by technology CAD tools. PIF/Gestalt is presented as a test implementation of the toolkit which provides C and Common Lisp language interfaces, implemented on a database for use in a CAD/CIM (computer integrated manufacturing) system for semiconductor process design and fabrication.