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A CAD procedure for optimizing bipolar devices relative to BiCMOS circuit delays

机译:一种针对BiCMOS电路延迟来优化双极型器件的CAD程序

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Proposes an optimization procedure for the bipolar base doping profile for a high-speed BiCMOS circuit. This procedure aims to achieve the minimum propagation delay time, taking the power supply, the load capacitance, and the bipolar device layout into consideration. For a small load capacitance, the peak base doping concentration and the base width should be as small as possible. However, for a high load capacitance, the optimized base doping profile can vary under the emitter area constraint. Utilizing this optimization procedure, it will be shown that the propagation delay time can be reduced by more than 30% at the same MOS current (I/sub MOS/=1 mA) through the coordinated reduction of both the vertical doping profile and the horizontal dimensions of the bipolar transistor, with the power supply voltage scaled from 5 to 3.3 V.
机译:针对高速BiCMOS电路的双极基极掺杂轮廓提出了优化程序。该程序旨在实现最小的传播延迟时间,同时考虑电源,负载电容和双极型器件布局。对于较小的负载电容,峰值基极掺杂浓度和基极宽度应尽可能小。但是,对于高负载电容,优化的基极掺杂分布可以在发射极面积约束下变化。利用该优化程序,将显示出通过协调减少垂直掺杂分布和水平掺杂,在相同的MOS电流(I / sub MOS / = 1 mA)下,传播延迟时间可以减少30%以上。电源电压范围从5到3.3 V的双极性晶体管尺寸。

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