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Substrate crosstalk suppression capability of silicon-on-insulator substrates with buried ground planes (GPSOI)

机译:具有埋地平面(GPSOI)的绝缘体上硅衬底的衬底串扰抑制能力

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摘要

Experimental s/sub 21/ transmission crosstalk studies have been conducted on silicon-on-insulator substrates with buried ground planes (GPSOI's) where a 2 /spl Omega/ per square metal-silicide buried ground plane existed between a 15 /spl Omega/-cm p-type silicon substrate and a 1 /spl mu/m thick buried CVD oxide layer. Locally grounded transmission test structures fabricated on GPSOI were found to exhibit 20 dB increased crosstalk suppression compared to published data for high resistivity (200 /spl Omega/-cm) SOI substrates incorporating capacitive guard rings over a frequency range from 500 MHz to 50 GHz. This represents an order of magnitude improvement in crosstalk power suppression capability compared to existing state-of-the-art suppression techniques in silicon substrates.
机译:已在具有埋入接地平面(GPSOI)的绝缘体上硅基板上进行了实验s / sub 21 /传输串扰研究,其中在15 / spl Omega /-之间存在2 / spl Omega /每平方的金属硅化物埋入接地平面。厘米p型硅衬底和1 / splμ/ m厚的掩埋CVD氧化物层。与公开的数据相比,在500 MHz至50 GHz频率范围内具有电容性保护环的高电阻率(200 / spl Omega / -cm)SOI基板,发现在GPSOI上制造的局部接地传输测试结构显示出增加的20 dB串扰抑制。与硅衬底中现有的最新抑制技术相比,这表示串扰功率抑制能力提高了一个数量级。

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