Fiber-array pigtailing and packaging of an InP-based opticalcross-connect chip

摘要

A method of coupling six single-mode fiber tapers with 250-Μmnspacing to an InP-based integrated optical cross-connect chip has beenndeveloped and realized. The complete pigtailed chip assembly is packagednwhile chip temperature can be controlled. The device is successfulntested at an ambient temperature range of 5°C to 45°C