Fiber-array pigtailing and packaging of an InP-based optical cross-connect chip

摘要

A method of coupling six single-mode fiber tapers with 250-/spl mu/m spacing to an InP-based integrated optical cross-connect chip has been developed and realized. The complete pigtailed chip assembly is packaged while chip temperature can be controlled. The device is successful tested at an ambient temperature range of 5/spl deg/C to 45/spl deg/C.