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Reducing Power Dissipation, Delay, and Area in Logic Circuits by Narrowing Transistors

机译:通过缩小晶体管来减少逻辑电路中的功耗,延迟和面积

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An important aspect of fast CMOS logic-circuit design is transistor sizing. Designers routinely set transistor channel lengths at the minimal values the process permits (unless there is a need to introduce delay). Specification of channel widths, however, requires careful consideration and is based mainly on the capacitive load the circuit must drive and on considerations of energy dissipation and chip area. Experienced designers use heuristic techniques to help with this aspect of circuit design. Sutherland and his associates have developed a powerful systematic method called logical effort. The method presented in this article, based on an analysis at the logic level, enables designers to identify transistors in certain logic elements whose channels can be narrowed to a minimum without incurring penalties. The logical effort method, or some other procedure, can then follow this preliminary step. Rabaey, Chandrakasan, and Nikolic present a simple situation that employs minimum-width transistors and clearly incurs no penalty. In this example, a weak feedback inverter serves to make a dynamic latch static. This article provides a systematic generalization of this idea. In a CMOS NAND gate, each PMOS transistor connects Z, the gate output, to supply voltage V_(DD). Suppose that with all input signals high, gate input X_(i) is turned off (V_(i) is switched from V_(DD) to 0). This activates PMOS transistor T_(pi), and current flows through its channel to charge output capacitance C_(out). The time constant for this charging process is the product of C_(out) and channel resistance R_(chi). I'll generally make the worst-case assumption that only one PMOS transistor is initially activated to turn on Z. I am also assuming that all transistor channel lengths are fixed at the minimal permissible values. Components of C_(out) include the input capacitance of the device (or devices) driven by the gate, and the gate's intrinsic capacitance, which consists of components from each transistor. Internal and external gate wiring also contribute. Of particular interest here is the contribution to the output capacitance made by each PMOS transistor of the NAND gate. This is roughly proportional to transistor channel width W_(p). Because each transistor's contribution is only a fraction of C_(out), the value of C_(out) increases much less than linearly with W_(p). Channel resistance R_(ch) is inversely proportional to channel width W_(p). Halving W_(p) for transistor T_(pi) will double R_(chi), while C_(out) will decrease by much less than half. Therefore, the time constant for the rise of V_(out) will increase significantly for transitions in which C_(out) is charged by the narrowed transistor when its gate signal switches to 0. But what about output transitions driven by other transistors? V_(out), when driven by a different transistor, T_(pj), will rise with a smaller time constant, because C_(out) decreases when W_(pi) decreases. Now consider a situation in which output voltage V_(z) is supposed to fall because X_(i), the signal feeding transistors T_(pi) and T_(ni), changes from 0 to 1 (assuming the other input signals to the gate are already high). Current flowing to ground through a series connection of activated NMOS transistors discharges C_(out). As before, C_(out) decreases as a result of narrowing T_(pi), which reduces the time constant for the output change. Because the capacitance that the source of the X_(i) signal sees also decreases as a consequence of reducing W_(pi), there is an additional reduction in Z's response time to the signal that increases X_(i). This effect also compensates, to some extent, for the increased delay in Z's response to a decrease in X_(i). In CMOS logic, losses due to the charging and discharging of capacitors strongly dominate power dissipation. To the extent that narrowing channels reduces circuit capacitance, the circuit's energy consumption will also decrease. In summary, a narrower PMOS transistor T_
机译:快速CMOS逻辑电路设计的一个重要方面是晶体管尺寸。设计人员通常将晶体管通道长度设置为工艺允许的最小值(除非需要引入延迟)。但是,通道宽度的规范需要仔细考虑,并且主要基于电路必须驱动的电容性负载,以及功耗和芯片面积的考虑。经验丰富的设计师使用启发式技术来帮助电路设计的这一方面。 Sutherland和他的同事们开发了一种强大的系统方法,称为逻辑努力。本文介绍的方法基于逻辑级别的分析,使设计人员能够识别某些逻辑元件中的晶体管,这些晶体管的沟道可以缩小到最小,而不会造成损失。然后,逻辑努力方法或某些其他过程可以遵循此初步步骤。 Rabaey,Chandrakasan和Nikolic提出了一种简单的情况,即采用最小宽度的晶体管,并且显然不会受到任何惩罚。在此示例中,弱反馈反相器用于使动态锁存器静态化。本文对这种想法进行了系统的概括。在CMOS与非门中,每个PMOS晶体管将栅极输出Z连接到电源电压V_(DD)。假设在所有输入信号为高电平的情况下,栅极输入X_(i)被关闭(V_(i)从V_(DD)切换为0)。这激活了PMOS晶体管T_(pi),并且电流流过其沟道以对输出电容C_(out)充电。该充电过程的时间常数是C_(out)与通道电阻R_(chi)的乘积。我通常会做出最坏的假设,即最初只激活一个PMOS晶体管以导通Z。我还假设所有晶体管的沟道长度都固定为最小允许值。 C_(out)的成分包括由栅极驱动的一个或多个器件的输入电容,以及由每个晶体管的成分组成的栅极的固有电容。内部和外部栅极布线也有贡献。这里特别令人感兴趣的是与非门的每个PMOS晶体管对输出电容的贡献。这大致与晶体管沟道宽度W_(p)成比例。由于每个晶体管的贡献只是C_(out)的一小部分,因此C_(out)的值增加的幅度远小于W_(p)的线性增加。沟道电阻R_(ch)与沟道宽度W_(p)成反比。将晶体管T_(pi)的W_(p)减半将使R_(chi)翻倍,而C_(out)的减小幅度将小于一半。因此,V_(out)上升的时间常数对于在变窄的晶体管的栅极信号切换为0时C_(out)充电的跃迁将大大增加。但是,由其他晶体管驱动的输出跃迁又如何呢?当由不同的晶体管T_(pj)驱动时,V_(out)将以较小的时间常数上升,因为当W_(pi)减小时C_(out)减小。现在考虑一种情况,其中由于X_(i),信号馈送晶体管T_(pi)和T_(ni)从0变为1(假设到栅极的其他输入信号)而导致输出电压V_(z)下降的情况已经很高)。通过激活的NMOS晶体管的串联连接流到地面的电流使C_(out)放电。如前所述,由于T_(pi)变窄,C_(out)减小,从而减小了输出变化的时间常数。由于减小W_(pi),X_(i)信号源所看到的电容也会减小,因此Z对增加X_(i)的信号的响应时间会进一步减少。这种效果在某种程度上还补偿了Z对X_(i)减小的响应增加的延迟。在CMOS逻辑中,由于电容器的充电和放电而造成的损耗在功耗中占主导地位。在某种程度上,狭窄的通道减少了电路电容,电路的能耗也将降低。总之,较窄的PMOS晶体管T_

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