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首页> 外文期刊>IBM Journal of Research and Development >Modeling and characterization of quantization, polysilicon depletion, and direct tunneling effects in MOSFETs with ultrathin oxides
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Modeling and characterization of quantization, polysilicon depletion, and direct tunneling effects in MOSFETs with ultrathin oxides

机译:具有超薄氧化物的MOSFET中的量化,多晶硅耗尽和直接隧穿效应的建模和表征

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The electrical characteristics (C-V and I-V) of n+- and p+-polysilicon-gated ultrathin-oxide capacitors and FETs were studied extensively to determine oxide thickness and to evaluate tunneling current. A quantum-mechanical model was developed to help understand finite inversion layer width, threshold voltage shift, and polysilicon gate depletion effects. It allows a consistent determination of the physical oxide thickness based on an excellent agreement between the measured and modeled C-V curves. With a chip standby power of ≤0.1 W per chip, direct tunneling current can be tolerated down to an oxide thickness of 15–20 Å. However, transconductance reduction due to polysilicon depletion and finite inversion layer width effects becomes more severe for thinner oxides. The quantum-mechanical model predicts higher threshold voltage than the classical model, and the difference increases with the electric field strength at the silicon/oxide interface.
机译:对n +和p +多晶硅门控的超薄氧化物电容器和FET的电学特性(C-V和IV)进行了广泛的研究,以确定氧化物的厚度并评估隧道电流。开发了一个量子力学模型来帮助理解有限的反型层宽度,阈值电压漂移和多晶硅栅极耗尽效应。它基于测量的C-V曲线和建模的C-V曲线之间的出色一致性,可以一致地确定物理氧化物的厚度。当每个芯片的芯片待机功率≤0.1W时,可以容许直接隧穿电流降低至15-20Å的氧化物厚度。但是,对于更薄的氧化物,由于多晶硅耗尽和有限的反型层宽度效应而导致的跨导降低变得更加严重。量子力学模型预测的阈值电压比经典模型高,并且差异随硅/氧化物界面处的电场强度而增加。

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