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首页> 外文期刊>IEEE Transactions on Electron Devices >Impact of tunnel currents and channel resistance on the characterization of channel inversion layer charge and polysilicon-gate depletion of sub-20-/spl Aring/ gate oxide MOSFETs
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Impact of tunnel currents and channel resistance on the characterization of channel inversion layer charge and polysilicon-gate depletion of sub-20-/spl Aring/ gate oxide MOSFETs

机译:隧道电流和沟道电阻对sub-20- / spl Aring /栅氧化物MOSFET的沟道反型层电荷和多晶硅栅耗尽特性的影响

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摘要

This paper discusses the limitations on MOSFET test structures used in extracting the polysilicon gate doping from capacitance-voltage (C-V) analysis in strong inversion, especially for ultrathin gate oxides. It is shown that for sub-20-/spl Aring/ oxide MOS devices, transistors with channel lengths less than about 10 /spl mu/m will be needed to avoid an extrinsic capacitance roll-off in strong inversion. The upper limit of the channel length has been estimated using a new simple transmission-line-model of the terminal capacitance, which accounts for the nonnegligible gate tunneling current and finite channel resistance.
机译:本文讨论了在强反转中从电容-电压(C-V)分析提取多晶硅栅极掺杂中使用的MOSFET测试结构的局限性,特别是对于超薄栅极氧化物而言。结果表明,对于低于20- / spl Aring /氧化物MOS器件,将需要沟道长度小于约10 / spl mu / m的晶体管,以避免在强反型时外在电容滚降。沟道长度的上限已使用端子电容的新的简单传输线模型进行了估算,该模型考虑了不可忽略的栅极隧穿电流和有限的沟道电阻。

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