Inspection and Analysis System for Wafer Pattern Defects

摘要

With the goal of improving the yield of new semiconductor devices, a system for detecting particles and appearance defects on a wafer has been developed. The system is capable of analyzing the number and distribution of wafer defects, and can also assist in locating the process and equipment in which the problems occurred. The overall system consists of detectors for examining particles and appearance defects, a workstation for analyzing data, and an electron microscope for detailed observation of particles and appearance defects.