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Electroplating on Connectors to Prevent Tin Reflow Discolouration

机译:在连接器上电镀以防止锡回流变色

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摘要

Now that lead-containing solders are prohibited in electrical and electronic assemblies, tin solders are a widely used replacement. During reflow, a colouring effect is observed which, though it has no adverse technical effects, is deemed unacceptable by most customers. A solution to this problem is to use a satin-finished tin coating with larger than usual grain size, or else an undercoating of nickel-phosphorus. An acidic post-treatment which selectively removes surface defects and oxidation products also ameliorates the problem. The optimum approach is to use all three methods, that is a nickel-phosphorus undercoat with satin-finish tin and a subsequent acid immersion.
机译:由于电气和电子组件中禁止使用含铅焊料,因此锡焊料已被广泛使用。在回流过程中,观察到着色效果,尽管它没有不利的技术影响,但大多数客户认为是不可接受的。解决此问题的方法是使用缎面抛光的锡涂层,其晶粒尺寸大于通常的晶粒尺寸,或者使用镍磷底涂层。选择性去除表面缺陷和氧化产物的酸性后处理也可以改善该问题。最佳方法是使用所有三种方法,即使用缎面处理锡的镍磷底涂层,然后进行酸浸。

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