SUSS MicroTec launches semiautomated high-force wafer bonder

摘要

SUSS MicroTec has launched the new bonding platform XB8. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates with a wafer size of up to 200 mm. Key process parameters can be adjusted in a wide range, which makes the system ideal for advanced process development. In a production environment, the high level of automation and reliability of the XB8 ensure a high level of process stability. Typical applications include advanced packaging, MEMS, 3D integration and LED manufacturing. Suss say the XB8 wafer bonder offers a broad parameter window and is therefore suitable for carrying out all bonding processes. Bond force up to 100kN is available with a temperature range of up to 550℃. Different substrate shapes and wafer sizes are processed in specifically adapted fixtures. A multi-bond fixture, for example, enables the maximum possible throughput increase by bonding up to eight wafers at once.