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Rudolph receives first order for fan-out panel-level packaging solution

机译:Rudolph接收扇出面板级包装解决方案的第一个订单

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RUDOLPH TECHNOLOGIES has announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph's exclusive StepFAST Solution for panel-level packaging production, which includes a repeat order for the JetStep panel lithography system. Rudolph's StepFAST Solution is a feed-forward adaptive shot technology that addresses process variations, die placement errors and dimensionally unstable materials that are common in existing and next-generation advanced packaging technologies. The elements included in the StepFAST Solution are Rudolph's Firefly system for die position metrology, Discover software for advanced analytics, and the JetStep system for exposure.
机译:Rudolph Technologies宣布,领先的外包装配和测试设施(OSAT)已经订购了Rudolph的Panel级包装生产的独家踏板解决方案,其中包括JetStep面板光刻系统的重复顺序。 Rudolph的Tepfast解决方案是一种前馈自适应拍摄技术,用于解决现有和下一代高级包装技术中常见的过程变化,模具放置误差和尺寸不稳定材料。待踏上解决方案中包含的元素是Rudolph的萤火虫系统,用于模具位置计量,发现高级分析软件以及用于曝光的JetStep系统。

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    《European Semiconductor》 |2019年第2期|6-6|共1页
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