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机译:用于异构整合的扇出芯片 - 最后面板级包装的热循环试验和仿真
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Unimicron Technology Corporation Taoyuan Taiwan;
Reliability; heterogeneous integration; fan-out chip-last panel-level technology;
机译:芯片 - 最后(RDL-First)扇出面板级包装(foplp)用于异构整合
机译:面板级扇出RDL-First包装用于异构整合
机译:芯片优先扇出式面板级封装,实现异构集成
机译:用于异构整合的芯片最后扇出板级包装的可靠性
机译:使用四点循环弯曲测试和热循环测试的四方扁平无铅封装(QFN)封装的寿命预测之间的关系
机译:扇出晶圆和面板级包装作为异构集成的包装平台
机译:扇出面板级PCB嵌入式SIC电源MOSFET包装