A new packaging technology using micro-solder bumps for high-speed photoreceivers

摘要

A packaging technology for high-speed photoreceivers with a photodiode and a preamplifier is introduced. This technology features the following key interconnection technologies: micro-solder bumps, an impedance matched film carrier, and an optical fiber unit. Micro-solder bumps eliminate parasitic elements of the interconnection between the preamplifier and the package, and provides an impedance matched interconnection. The optical fiber unit with hemispherical-lensed fibers carries out high-efficiency optical coupling. The photoreceiver fabricated by applying these technologies achieves 3 dB bandwidth at over 20 GHz. This packaging technology should be effective for future high-speed optical transmission systems of over 10 Gbit/s.