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Semiconductor optical preamplifiers for use in high-speed integrated photoreceivers at 1.3 um and 1.55 um.

机译:半导体光学前置放大器,用于1.3微米和1.55微米的高速集成光接收器。

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摘要

We have studied issues relevant to the monolithic integration of semiconductor optical preamplifiers with photodetectors for high-speed receiver applications at 1.3 m m and 1.55 m m. This work stems from the fact that high data-rate optical communication systems have created an increasing demand for sensitive, high-speed optoelectronic receivers at these wavelengths. The approach of optical preamplification is known to increase the ultimate sensitivity possible for a receiver, and the cost of such schemes can often be decreased, with increasing reliability, through monolithic integration.; The study is organized as follows. First, double-heterostructure optical amplifier devices are characterized at 1.55 m m for AM modulation-frequency response up to 20 GHz, possibly for the first time. Experimental results include high-frequency effects due to facet reflectivity, as well as low-frequency effects attributed to the carrier-recombination lifetime. Second, a self-aligned processing scheme is developed for fabricating semiconductor lasers, optical amplifiers, and photodetectors in this material system; this scheme emphasizes fabrication simplicity and low contact resistance. In addition, strained-layer and lattice-matched epitaxial structures for optical amplifiers and lasers are developed and grown here, although with limited success. Third, epitaxial layer designs for monolithically integrated amplifiers/photodetectors are proposed and analyzed. Design emphasis is placed on efficient coupling of desired light from the optical amplifier to photodetector, minimization of optical feedback to the amplifier, and reducing the spontaneous emission coupled to the detector.
机译:我们研究了与半导体光学前置放大器与光电探测器在1.3 m m和1.55 m m。这项工作源于以下事实:高数据速率光通信系统对这些波长的灵敏,高速光电接收器提出了越来越高的要求。众所周知,光学预放大的方法可以增加接收机的最终灵敏度,并且通过单片集成,可以提高可靠性,通常可以降低这种方案的成本。该研究组织如下。首先,对于高达20 GHz的AM调制频率响应,双异质结构光放大器器件的特征是1.55 m m时间。实验结果包括由于小面反射率引起的高频效应,以及归因于载流子复合寿命的低频效应。其次,开发了一种自对准处理方案,用于在该材料系统中制造半导体激光器,光放大器和光电探测器。该方案强调了制造的简便性和低接触电阻。此外,在这里开发并生长了用于光放大器和激光器的应变层和晶格匹配的外延结构,尽管取得的成功有限。第三,提出并分析了单片集成放大器/光电检测器的外延层设计。设计重点放在从光放大器到光电检测器的所需光的有效耦合,最小化到放大器的光反馈以及减少耦合到检测器的自发发射上。

著录项

  • 作者

    Horton, Timothy Uel.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1998
  • 页码 64 p.
  • 总页数 64
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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