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GaAs passivation by low-frequency plasma-enhanced chemical vapour deposition of silicon nitride

机译:低频等离子体增强氮化硅的化学气相沉积法钝化GaAs

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摘要

Passivation of GaAs by silicon nitride (Si_xN_y) deposition using low-frequency PECVD (LF PECVD) is presented. The high amount of hydrogen implantation during this process enhances the passivation effect, demonstrating for the first time the unpinning of the Fermi level by a simple deposition of Si_xN_y, on a deoxidised GaAs surface. The (NH_4)_2S/Si_xN_y passivation is also simplified, and MIS capacitors are fabricated by a novel process, which consists in exposing the GaAs surface directly to sulphur solution, without the usual deoxidation etching step, followed by the deposition of LF PECVD Si_xN_y,. Good modulation of the surface potential is observed, and the interface state density (D_(it)) as measured from 1 MHz C-V characteristics has a minimum of 3 x 10~(11) cm~(-2) eV~(-1).
机译:提出了利用低频PECVD(LF PECVD)通过氮化硅(Si_xN_y)沉积对GaAs进行钝化的方法。在此过程中大量的氢注入增强了钝化效果,这首次证明了通过在脱氧的GaAs表面上简单沉积Si_xN_y来使费米能级脱钉。还简化了(NH_4)_2S / Si_xN_y钝化,并通过一种新颖的工艺制造MIS电容器,该工艺包括将GaAs表面直接暴露于硫溶液中,而无需通常的脱氧蚀刻步骤,然后沉积LF PECVD Si_xN_y, 。观察到表面电势的良好调制,并且从1 MHz CV特性测得的界面态密度(D_(it))的最小值为3 x 10〜(11)cm〜(-2)eV〜(-1) 。

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