Wafer-level vacuum encapsulated breath-mode ring resonator fabricated in a commercial MEMS process

摘要

The development of wafer-level vacuum-encapsulated low-voltage and high quality factor (Q) ring resonator is presented. The resonator is fabricated using microelectromechanical systems (MEMS) integrated design for inertial sensors process introduced by Teledyne DALSA Semiconductor Inc.. The resonator is designed to be operational with 5 V DC polarisation voltage in the breath mode of vibration at a resonance frequency of 10 MHz. The measured Q of the ring resonator exceeded 84,000.