Equivalent Circuit Analysis for Vias in Multilayered Printed Circuit Boards by Optimization Method

摘要

In this paper, a highly accurate equivalent circuit is constructed that can calculate the transmission characteristics of the vias connecting the layers in multilayered printed circuit boards. Various factors of the vias affecting the transmission characteristics are discussed. The present equivalent circuit is based on the physical structure and the equivalent circuit parameters are determined by an optimization method. The equivalent circuit is applied to the vias in printed circuit boards with more than 10 layers. The results of evaluation of the transmission characteristics in the gigahertz range are verified by the FDTD method and by measurement so as to verify their validity. Further, by using the present equivalent circuit, the effects of various factors of the vias on the transmission characteristics are studied. It is demonstrated that the time needed for study by the equivalent circuit is less than that needed for numerical analysis.