MOSFET package reduces thermal impedance

摘要

The CSD16325Q5C DualCool NexFET is presented as the industry's first standard-footprint power MOSFET family. It dissipates heat through the top of the package, provides up to 50% more current through the device than standard packaging, and improves thermal impedance to therntop of the package from 15℃/W to 1.2℃/W, increasing power dissipation capability by up to 80%.