Reply to 'Comparison of thermal-shunt and flip-chip HBT thermal impedances: comment on novel HBT with reduced thermal impedance'

Hill D.; Khatibzadeh A.

首页> 外文期刊>IEEE Microwave and Guided Wave Letters >Reply to 'Comparison of thermal-shunt and flip-chip HBT thermal impedances: comment on novel HBT with reduced thermal impedance'

【24h】

Reply to 'Comparison of thermal-shunt and flip-chip HBT thermal impedances: comment on novel HBT with reduced thermal impedance'

机译：回复“热分流和倒装芯片HBT热阻的比较：对具有减小的热阻的新型HBT的评论”

获取原文

获取外文期刊封面封底 >>

开具论文收录证明 >>

文献代查 >>

团队文献服务 >>

页面导航

著录项
引文网络
相似文献
相关主题

著录项

来源
《IEEE Microwave and Guided Wave Letters》 |1996年第8期|共页
作者
Hill D.; Khatibzadeh A.;
展开▼
作者单位

展开▼
收录信息
原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词

相似文献

外文文献
中文文献
专利

1. Comparison of thermal-shunt and flip-chip HBT thermal impedances: comment on "Novel HBT with reduced thermal impedance" [J] . Jenkins T., Bozada C. IEEE Microwave and Guided Wave Letters . 1996,第7期

机译：热分流和倒装芯片HBT热阻的比较：评论“降低热阻的新颖HBT”
2. Thermal Penetration Depth Analysis and Impact of the BEOL Metals on the Thermal Impedance of SiGe HBTs [J] . Rosario D’Esposito, Suresh Balanethiram, Jean-Luc Battaglia, IEEE Electron Device Letters . 2017,第10期

机译：BEOL金属的热渗透深度分析及其对SiGe HBT热阻的影响
3. A Geometry Scalable Model for Nonlinear Thermal Impedance of Trench Isolated HBTs [J] . Sahoo A.K., Fregonese S., Desposito R., Electron Device Letters, IEEE . 2015,第1期

机译：沟槽隔离式HBT的非线性热阻的几何可扩展模型
4. Electro-thermal dynamic simulation and thermal spreading impedance modeling of Si-Ge HBTs [C] . 2011 IEEE Bipolar/BiCMOS Circuits and Technology Meeting . 2011

机译：Si-Ge HBT的电热动力学模拟和热扩散阻抗建模
5. Power-Derived Thermal Characterization of SiGe HBTs and Design of Timing Circuit using a Phase Locked-Loop. [D] . Shah, Valay Dineshbhai. 2016

机译：SiGe HBT的功率衍生热表征和使用锁相环的定时电路设计。
6. Thermal Impedance Characterization Using Optical Measurement Assisted by Multi-Physics Simulation for Multi-Chip SiC MOSFET Module [O] . Min-Ki Kim, Sang Won Yoon 2020

机译：多芯片SIC MOSFET模块多物理仿真辅助光学测量的热阻抗表征
7. Thermal Penetration Depth Analysis and Impact of the BEOL Metals on the Thermal Impedance of SiGe HBTs [O] . D'Esposito, Rosario, Balanethiram, Suresh, Battaglia, Jean-Luc, 2017

机译：BEOL金属的热渗透深度分析及其对SiGe HBT热阻的影响

Reply to 'Comparison of thermal-shunt and flip-chip HBT thermal impedances: comment on novel HBT with reduced thermal impedance'

著录项

引文网络

相似文献

相关主题

期刊订阅