Tin-lead BGA μModule products target military & aerospace applications

摘要

One solution to address these needs is Linear Technology's μModule technology, providing a complete system-in-a-package solution that simplifies design and minimises external components. The original packaging technology selected for μModule switching regulators was LGA (land grid array) and this has served the broad marketplace well. However, some applications subject to very harsh environments prefer BGA (ball grid array) interconnect and Linear Technology has developed packaging to satisfy these requirements.