Flip Chip Underfill Process Speeds Up

摘要

Flip chips and the substrates on which they are placed have different coefficients of thermal expansion (CTE). To compensate for this difference, underfill material is deposited between flip chips and substrates to distribute the stress caused by the differing CTEs. Underfill typically is applied using automated liquid dispensing equipment. Capillary action allows easily flowing underfill material to completely fill the gap between chip and substrate. Once cured, the liquid material becomes hard.