As component spacing gets tighter and integrated circuits generate more heat, cooling becomes more important and more difficult. Chips on an overheated board have a much shorter lifetime and will probably malfunction before the warranty runs out. Today's packaging designers, however, can take advantage of an increasing array of heat sinks as well as many creative techniques that ensure printed circuit boards (PCBs) get the cooling they require. Cooling solutions are available for components even in the tight spacing demanded by Peripheral Component Interconnect (PCI) and CompactPCI standards.
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