首页> 外文期刊>International Communications in Heat and Mass Transfer >CONVECTIVE HEAT TRANSFER FROM SIMULATED AIR-COOLED PRINTED-CIRCUIT BOARD ASSEMBLY ON HORIZONTAL OR VERTICAL ORIENTATION
【24h】

CONVECTIVE HEAT TRANSFER FROM SIMULATED AIR-COOLED PRINTED-CIRCUIT BOARD ASSEMBLY ON HORIZONTAL OR VERTICAL ORIENTATION

机译:模拟空冷印刷电路板组件在水平方向或垂直方向上的对流换热

获取原文
获取原文并翻译 | 示例
           

摘要

An experimental and numerical analyses had been performed to investigate the convective heat transfer in a rectangular duct flow with streamwise-periodic rectangular heated ribs mounted on one of the principal walls, which simulated a printed-circuit board (PCB) assembly. Experimental investigation were carried out with the PCB assembly orientated in both horizontal and vertical positions. Effects of varying the duct's height, and the rib's height and width on convection from the rib's surface to the air-flow were studied. The heat transfer measurements were obtained for unencumbered height-based Reynolds number from 510 to 2050. Predictive correlations valid over a range of Reynolds numbers, duct height-to-rib height ratios (H/B) and rib's width-to-height ratios (L/B) were proposed.
机译:已经进行了实验和数值分析,以研究矩形管道流中的对流换热,其中在其中一个主壁上安装了流周期的矩形加热肋,从而模拟了印刷电路板(PCB)组件。在PCB组件水平和垂直方向上进行了实验研究。研究了改变风管高度以及肋骨的高度和宽度对从肋骨表面到气流对流的影响。对于510到2050年的不受阻碍的基于高度的雷诺数,获得了传热测量结果。预测的相关性在一定范围的雷诺数,风管高度与肋骨高度比(H / B)和肋骨的宽度与高度比( (L / B)。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号