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A printed circuit board assembly, in which at least a second printed circuit board can be cooled by means of a first printed circuit board

机译:印刷电路板组件,其中至少第二印刷电路板可通过第一印刷电路板冷却

摘要

A printed circuit board assembly (10; 110), comprising a first printed circuit board (12; 112) and at least a second printed circuit board (14; 114), which, via at least one plug connector arrangement (18) electrically coupled to one another or are coupled electrically;in which the second printed circuit board (14; 114) of a preferably at least one processor comprehensive electronic circuit (20; 120), which in the operation of heat to be dissipated is generated, which, through at least one heat removal section point (22) of the second printed circuit board (14; 114) to be dissipated,characterized in that, the heat removal section point (22) on one of the first printed circuit board (12; 112) facing side of the second printed circuit board (14; 114) is arranged and provided with a heat receiving section point (24; 124) of the first printed circuit board (12; 112), or can be brought in a heat-transfer connection is the of the second printed circuit board (14; 114) heat to be dissipated via the first printed circuit board (12; 112) to dissipate.
机译:印刷电路板组件(10; 110),包括第一印刷电路板(12; 112)和至少第二印刷电路板(14; 114),其通过至少一个插头连接器装置(18)电耦合彼此电耦合或电耦合;其中优选地至少一个处理器综合电子电路(20; 120)的第二印刷电路板(14; 114)在要散发热量的操作中产生,通过第二印刷电路板(14; 114)的至少一个散热截面点(22)被消散,其特征在于,第一印刷电路板(12; 112)之一上的散热截面点(22)。在第二印刷电路板(14; 114)的相对侧面上布置并设置有第一印刷电路板(12; 112)的受热截面点(24; 124),或者可以进行热传递。连接是第二印刷电路板(14; 114)的散热v ia是第一印刷电路板(12; 112)消散。

著录项

  • 公开/公告号DE202016001189U1

    专利类型

  • 公开/公告日2016-03-23

    原文格式PDF

  • 申请/专利权人 DH ELECTRONICS GMBH;

    申请/专利号DE20162001189U

  • 发明设计人

    申请日2016-02-22

  • 分类号G06F1/20;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 14:08:59

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