Advances in Epoxy Dispensing Spark Microelectronics Automation

摘要

Manufacturers of electronic packages must meet the demands of their customers. Typical customer requirements include requirements of increased product miniaturization, power, circuit frequency and complexity. At the same time, shorter product cycles minimize the time available to ramp to volume production. Advanced microelectronics packaging for microwave, hybrids, MEMs and photonics is considered to be among the most challenging of all dispense applications.