CSP—Today's IC Packaging for Tomorrow's Technology

摘要

Newer generations of ICs have abandoned the traditional lead-frame methodology for the more versatile land or ball grid array (BGA) format. The seemingly wide variations of package methodology for ICs may be a bit overwhelming to the design engineers attempting to make a choice on package technology, decisions that will often impact their companies' success. The plastic molded lead-frame package (although economical) does not compare favorably to array contact packaging, especially for the higher I/O or performance-driven applications. The array package has proved to be a more rugged structure for assembly handling, and with the contacts beneath the device outline, interconnection between devices can be more direct. However, the BGA package families do vary a great deal in size, contact pitch and I/O, and they are more often designed for specific applications.