Flip Chip Process Challenges for SMT Assembly

摘要

You have heard it countless times before: consumer electronic products such as cell phones, PDAs, digital cameras, etc. are getting smaller, faster, smarter. Consequently, electronics packaging and assembly capabilities must keep pace. Improvements in materials, equipment performance and process control are allowing more EMS companies to move beyond standard surface mount technology (SMT) into the world of advanced assembly technology, including flip chip. As more and more products are designed to minimize space, operate faster and provide higher levels of functionality, the use of flip chip technology will grow and eventually become as standard a technology as SMT is today. You have also heard about the convergence of semiconductor packaging and EMS companies and how each is moving toward the other in terms of capability and portfolio. In our industry's ever-demanding environment, where more companies are providing "the total solution," this convergence is to be expected. But there are challenges for both sides.