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Improvement of alpha-particle-induced soft-error immunity in a GaAs SRAM by a buried p-layer

机译:通过掩埋p层提高GaAs SRAM中α粒子诱导的软错误免疫力

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Alpha-particle-induced soft-error immunity in a 1-kB GaAs SRAM was improved by a buried p-layer, which was formed in isolation regions as well as in FET regions and was designed to be completely depleted. The mean time between failures exceeded 10/sup 4/ at an alpha-particle fluence of about 2.0*10/sup 4/ cm/sup -2/-s/sup -1/ with a 1.0- mu Ci/sup 241/Am source. The alpha-particle energy had a peak at 4.0 MeV and was distributed from nearly 0 to 4.6 MeV. This value is five orders of magnitude better than that for a conventional SRAM without a buried p-layer. This improvement in the soft-error immunity can be achieved without increasing the access time or the power consumption by depleting the p-layer completely. Also discussed is the possibility of using a conductive p-layer scheme for higher integration of GaAs SRAMs.
机译:1-kB GaAs SRAM中的Alpha粒子诱导的软错误免疫性通过掩埋p层得到了改善,该p层形成在隔离区以及FET区中,并且被设计为完全耗尽。两次故障之间的平均时间超过10 / sup 4 /,α粒子注量约为2.0 * 10 / sup 4 / cm / sup -2 / -s / sup -1 /,而1.0-mu Ci / sup 241 / Am资源。 α粒子能量在4.0 MeV处有一个峰值,并且分布在从0到4.6 MeV的范围内。该值比没有掩埋p层的常规SRAM高五个数量级。通过完全耗尽p层,可以在不增加访问时间或功耗的情况下实现软错误抗扰性的这一提高。还讨论了将导电p层方案用于GaAs SRAM更高集成度的可能性。

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