首页> 外国专利> Hemispherical-grained silicon top-gate electrode for improved soft-error immunity in SRAMs

Hemispherical-grained silicon top-gate electrode for improved soft-error immunity in SRAMs

机译:半球形硅顶栅电极可改善SRAM中的抗软错误性

摘要

An SRAM cell having improved soft error immunity connects each of the storage nodes of the SRAM cell to an overlying electrode having a textured surface which is separated from a constant potential plate electrode by a dielectric layer. The textured surface of the overlying electrode may be created by forming hemispherical-grained silicon on its surface, or by forming a fin structure on its surface. The textured surface of the overlying electrode provides increased capacitance between the overlying electrode and the constant potential plate electrode, thereby increasing the capacitance of the storage node.
机译:具有改善的软错误抗扰性的SRAM单元将SRAM单元的每个存储节点连接到具有纹理化表面的上覆电极,该上覆电极通过介电层与恒电位板电极隔开。可以通过在其表面上形成半球形晶粒的硅,或者通过在其表面上形成鳍状结构,来形成上覆电极的纹理化表面。叠置电极的纹理化表面在叠置电极和恒电位平板电极之间提供了增加的电容,从而增加了存储节点的电容。

著录项

  • 公开/公告号EP0821412A1

    专利类型

  • 公开/公告日1998-01-28

    原文格式PDF

  • 申请/专利权人 UNITED MICROELECTRONICS CORPORATION;

    申请/专利号EP19960111963

  • 发明设计人 SUN SHIH-WEI;

    申请日1996-07-24

  • 分类号H01L27/11;

  • 国家 EP

  • 入库时间 2022-08-22 02:49:50

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