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首页> 外文期刊>IEEE Transactions on Electron Devices >Inverse staggered poly-Si and amorphous Si double structure TFT's for LCD panels with peripheral driver circuits integration
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Inverse staggered poly-Si and amorphous Si double structure TFT's for LCD panels with peripheral driver circuits integration

机译:带有外围驱动器电路集成的LCD面板的反向交错多晶硅和非晶硅双结构TFT

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摘要

Inverse staggered polycrystalline silicon (poly-Si) and hydrogenated amorphous silicon (a-Si:H) double structure thin-film transistors (TFT's) are fabricated based on the conventional a-Si:H TFT process on a single glass substrate. After depositing a thin (20 nm) a-Si:H using the plasma CVD technique at 300/spl deg/C, Ar/sup +/ and XeCl (300 mJ/cm/sup 2/) lasers are irradiated successively, and then a thick a-Si:H (200 nm) and n/sup +/ Si layers are deposited again. The field effect mobilities of 10 and 0.5 cm /sup 2//V/spl middot/s are obtained for the laser annealed poly-Si and the a-Si:H (without annealing) TFT's, respectively.
机译:逆交错多晶硅(poly-Si)和氢化非晶硅(a-Si:H)双结构薄膜晶体管(TFT's)是基于常规a-Si:H TFT工艺在单个玻璃基板上制造的。在300 / spl deg / C下使用等离子CVD技术沉积薄(20 nm)的a-Si:H之后,依次照射Ar / sup + /和XeCl(300 mJ / cm / sup 2 /)激光,然后再次沉积厚的a-Si:H(200 nm)和n / sup + / Si层。对于激光退火的多晶硅和a-Si:H(无退火)TFT,场效应迁移率分别为10和0.5 cm / sup 2 // V / spl middot / s。

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