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An analytical drain current model for submicrometer and deep submicrometer MOSFET's

机译:亚微米和深亚微米MOSFET的分析漏电流模型

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摘要

In this paper, we present a new, analytical, and physics-based drain current model for both submicrometer and deep submicrometer MOSFET's. The model was developed by starting from a two-dimensional (2D) Poisson equation and using the energy balance equation. Using the present model, we can clearly see that the drain current increases with decreasing channel length due to a larger average channel mobility at shorter channel length. The formulas for the saturation drain voltage and the drain current can be reduced to their corresponding well-known formulas in the submicrometer range. The accuracy of the presented model has been verified with the experimental data of metal-oxide-semiconductor (MOS) devices with various geometries.
机译:在本文中,我们针对亚微米和深亚微米MOSFET提出了一种新的,基于分析的,基于物理的漏极电流模型。通过从二维(2D)泊松方程开始并使用能量平衡方程来开发模型。使用本模型,我们可以清楚地看到,由于在较短的沟道长度处具有较大的平均沟道迁移率,因此漏极电流随沟道长度的减小而增加。可以将饱和漏极电压和漏极电流的公式简化为亚微米范围内的相应的众所周知的公式。所提出模型的准确性已通过具有各种几何形状的金属氧化物半导体(MOS)器件的实验数据进行了验证。

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