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Corrugated quantum well infrared photodetectors with polyimide planarization for detector array applications

机译:波纹聚酰亚胺阱平面量子阱红外光电探测器,用于探测器阵列应用

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Recently, we have demonstrated a new light coupling scheme for quantum well infrared photodetectors (QWIP). The new detector structure, referred to as corrugated QWIP (C-QWIP), is created by chemically etching linear V-grooves through the detector active region. In this structure, normal incident light is directed into the detector active region through total internal reflection, with which the optical absorption of the material is increased. However, the exposed active layers have to be insulated by a dielectric material before the top metal contact can be deposited for bonding purpose. In this paper, we describe a multilayer planarization scheme using a polyimide dielectric, which is developed specifically for this detector geometry, and report the resulting detector performance. The photoresponse of the detector with linear V-grooves pattern is found to be a factor of 1.6 larger than that of a regular edge coupled detector when they are normalized to the same dark current level. No wavelength or size dependence is observed using this coupling scheme, for detector sizes ranging from 50/spl times/50 /spl mu/m/sup 2/ to 500/spl times/500 /spl mu/m/sup 2/. With these two coupling characteristics, a C-QWIP behaves as a detector with normal incident absorption, a feature that will greatly improve the manufacturability of detector arrays and can be expected to lead to widespread applications of the QWIP technology.
机译:最近,我们展示了一种用于量子阱红外光电探测器(QWIP)的新光耦合方案。这种新的检测器结构称为波纹QWIP(C-QWIP),是通过化学腐蚀穿过检测器有源区的线性V型槽而创建的。在这种结构中,垂直入射光通过全内反射进入检测器的活动区域,从而增加了材料的光吸收。然而,在可以沉积顶部金属触点以用于结合目的之前,暴露的有源层必须通过介电材料绝缘。在本文中,我们描述了一种使用聚酰亚胺电介质的多层平面化方案,该方案是专门针对这种探测器几何形状开发的,并报告了所得的探测器性能。当将线性V槽图案的检测器归一化为相同的暗电流水平时,发现其光响应比常规边缘耦合检测器的光响应大1.6倍。对于50 / spl次/ 50 / spl mu / m / sup 2 /到500 / spl次/ 500 / spl mu / m / sup 2 /的检测器尺寸,使用此耦合方案未观察到波长或尺寸依赖性。通过这两个耦合特性,C-QWIP可以充当具有正常入射吸收的检测器,该功能将大大改善检测器阵列的可制造性,并且有望导致QWIP技术的广泛应用。

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