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Full band Monte Carlo simulation of zincblende GaN MESFET's including realistic impact ionization rates

机译:闪锌矿GaN MESFET的全频带Monte Carlo模拟,包括实际的碰撞电离率

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摘要

In this paper, we present the first theoretical study of the breakdown properties of zincblende phase GaN MESFET devices. The calculations are made using a full band, ensemble Monte Carlo simulation that includes a numerical formulation of the impact ionization transition rates. The breakdown voltage, transconductance and cutoff frequency are calculated for the GaN MESFET under two different conditions, with and without semiconductor-oxide interface states. Uniform surface depletion regions model the effect of the interface states. It is found that the breakdown voltage of the zincblende GaN MESFET is less dependent upon the surface depletion conditions than a corresponding GaAs MESFET. It is also found that the drain current increases more gradually with increasing drain-source voltage at the onset of breakdown and that the breakdown voltage of the zincblende GaN MESFET is predicted to be several times larger than that of a comparable GaAs MESFET. The maximum current gain cutoff frequency of a 0.1 /spl mu/m gate length GaN MESFET is calculated to be 230 and 220 GHz, for the non-surface-depleted and the surface depleted devices respectively.
机译:在本文中,我们提出了锌闪相GaN MESFET器件击穿特性的第一个理论研究。使用全频带整体蒙特卡洛模拟进行计算,其中包括冲击电离跃迁速率的数值公式。在有和没有半导体-氧化物界面状态的两种不同条件下,计算了GaN MESFET的击穿电压,跨导和截止频率。均匀的表面耗尽区可模拟界面状态的影响。发现与相应的GaAs MESFET相比,闪锌矿型GaN MESFET的击穿电压对表面耗尽条件的依赖性较小。还发现在击穿开始时,漏极电流随着漏极-源极电压的增加而逐渐增加,并且闪锌矿型GaN MESFET的击穿电压预计将比同类GaAs MESFET大几倍。对于非表面耗尽型器件和表面耗尽型器件,栅极长度GaN MESFET的最大电流增益截止频率为0.1 / spl mu / m,分别为230 GHz和220 GHz。

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