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Low-voltage hot electrons and soft-programming lifetime prediction in nonvolatile memory cells

机译:非易失性存储单元中的低压热电子和软编程寿命预测

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This paper reports experiments and Monte Carlo (MC) simulations of flash memory cells at the typical bias conditions of read operations (high V/sub GS/ and low V/sub DS/) leading to the soft-programming phenomenon. Comparing experiments with simulations we first show that, differently from the previously reported case of homogeneous injection experiments, efficient energy gain mechanisms must be invoked to explain the order of magnitude of gate (I/sub G/) and substrate (I/sub B/) currents at low voltage. Second, the voltage scaling behavior of the soft-programming lifetime is analyzed and the validity of usual extrapolation techniques to evaluate this parameter is addressed.
机译:本文报道了在典型的读取操作偏置条件(高V / sub GS /和低V / sub DS /)下导致软编程现象的闪存单元的实验和Monte Carlo(MC)仿真。首先将实验与模拟进行比较,我们发现与先前报道的均匀注入实验不同,必须调用有效的能量增益机制来解释浇口(I / sub G /)和衬底(I / sub B / )低电压电流。其次,分析了软编程寿命的电压缩放行为,并讨论了评估该参数的常用外推技术的有效性。

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