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A novel Si/SiGe heterojunction pMOSFET with reduced short-channel effects and enhanced drive current

机译:新型的Si / SiGe异质结pMOSFET,具有减少的短沟道效应和增强的驱动电流

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摘要

A novel Si/SiGe bandgap engineered pMOSFET structure, called a high mobility heterojunction transistor (HMHJT), is proposed. Reduced short-channel effects and high drive current are predicted in this new device. Simulation results of devices with 100-nm physical gate lengths are presented. Physical effects are illustrated, and the performance is compared to the conventional Si devices. For low standby power or low leakage (high V/sub T/) applications, the off-state leakage current due to drain induced barrier lowering (DIBL) or bulk punchthrough is substantially suppressed, and a very high I/sub on//I/sub off/ ratio of 6/spl times/10/sup 7/ is obtained in a HMHJT without any anti-punchthrough implant. This ratio is a factor of 180 higher than that of a fabricated, conventional Si device with a similar threshold voltage found in the literature. On the other hand, for lower operating power (low V/sub T/) applications, an HMHJT has a drive current 80% higher compared to an optimized Si device, while satisfying the same criteria for the off-state leakage current.
机译:提出了一种新型的Si / SiGe带隙工程pMOSFET结构,称为高迁移率异质结晶体管(HMHJT)。预计这种新型器件将减少短沟道效应并提高驱动电流。给出了具有100 nm物理栅极长度的器件的仿真结果。说明了物理效果,并将性能与常规Si器件进行了比较。对于低待机功耗或低泄漏(高V / sub T /)应用,由于漏极引起的势垒降低(DIBL)或体穿通而导致的关态泄漏电流得到了显着抑制,并且I / sub on // I很高在没有任何抗穿通注入的HMHJT中,获得/ sub off /的比率为6 / spl乘以10 / sup 7 /。该比率比文献中发现的具有相似阈值电压的常规Si器件的制造过程高180倍。另一方面,对于较低的工作功率(低V / sub T /)应用,HMHJT具有比优化的Si器件高80%的驱动电流,同时满足关态泄漏电流的相同标准。

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