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首页> 外文期刊>IEEE Transactions on Electron Devices >A novel high-voltage sustaining structure with buried oppositely doped regions
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A novel high-voltage sustaining structure with buried oppositely doped regions

机译:具有掩埋相反掺杂区的新型高压维持结构

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摘要

A novel high-voltage sustaining structure with buried oppositely doped regions is demonstrated. Due to the compensation of the electric field provided by these regions, the resistivity and/or the thickness of the voltage-sustaining layer can be made smaller than that of a conventional one with the same breakdown voltage, and therefore the on-resistance (of unipolar conduction) can be reduced. The theory developed for designing such structures is found to be in good agreement with the results obtained from two-dimensional (2-D) simulation as well as from experiment. A 500 V VD-MOST using such a structure as the drift region and with proper edge termination is fabricated. Results show that its on-resistance is lower than the value given by the conventional "silicon limit".
机译:展示了一种新颖的高压维持结构,该结构具有掩埋相反掺杂的区域。由于这些区域提供的电场的补偿,可以使电压保持层的电阻率和/或厚度小于具有相同击穿电压的常规电阻率和/或厚度,从而导通电阻(单极传导)可以减少。发现开发用于设计此类结构的理论与从二维(2-D)仿真以及实验获得的结果非常吻合。制造了使用诸如漂移区之类的结构并具有适当边缘终止的500 V VD-MOST。结果表明其导通电阻低于常规“硅极限”给出的值。

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